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? 1. general description the adc1010s is a single-channel 10-bit anal og-to-digital converter (adc) optimized for high dynamic performance and low power consumption at sample rates up to 125 msps. pipelined architecture and output error correction ensure the adc1010s is accurate enough to guarantee zero missing codes over t he entire operating range. supplied from a single 3 v source, it can handle output logic levels from 1.8 v to 3.3 v in cmos mode, because of a separate digital output supply . it supports the low voltage differential signaling (lvds) double data rate (ddr) output standard. an integrated serial peripheral interface (spi) allows the user to easily configure the adc. the device also includes a programmable full-scale spi to allow a flexible input voltage range from 1 v to 2 v (peak-to-peak). with excellent dynamic performance from the baseband to input frequencies of 170 mhz or more, the a dc1010s is ideal for us e in communications, imaging and medical applications. 2. features and benefits 3. applications adc1010s series single 10-bit adc; 65 msps, 80 msps, 105 msps or 125 msps; cmos or lvds ddr digital outputs rev. 03 ? 2 july 2012 product data sheet ? snr, 62 dbfs; sfdr, 86 dbc ? input bandwidth, 600 mhz ? sample rate up to 125 msps ? power dissipation, 430 mw at 80 msps ? 10-bit pipelined adc core ? serial peripheral interface (spi) ? clock input divided by 2 for less jitter ? duty cycle stabilizer ? single 3 v supply ? fast out-of-range (otr) detection ? flexible input voltage range: 1 v (p-p) to 2 v (p-p) ? offset binary, two?s complement, gray code ? cmos or lvds ddr digital outputs ? power-down and sleep modes ? pin compatible with the adc1410s series and the adc1210s series ? hvqfn40 package ? wireless and wired broadband communications ? portable instrumentation ? spectral analysis ? imaging systems ? ultrasound equipment ? software defined radio
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 2 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 4. ordering information 5. block diagram table 1. ordering information type number f s (msps) package name description version adc1010s125hn-c1 125 hvqfn40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 ? 6 ? 0.85 mm sot618-1 ADC1010S105HN-C1 105 hvqfn40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 ? 6 ? 0.85 mm sot618-1 adc1010s080hn-c1 80 hvqfn40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 ? 6 ? 0.85 mm sot618-1 adc1010s065hn-c1 65 hvqfn40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 ? 6 ? 0.85 mm sot618-1 fig 1. block diagram adc1010s spi interface output drivers output drivers system reference and power management error correction and digital processing adc core 10-bit pipelined t/h input stage inp otr cs sdio/ods sclk/dfs pwd reft cmos: d9 to d0 or lvds ddr: d8_d9_m to d0_d1_m d8_d9_p to d0_d1_p inm clock input stage and duty cycle control refb clkm clkp sense vref vcm 005aaa134 oe cmos: dav or lvds ddr: davp davm
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 3 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration with cmos digital outputs selected fig 3. pin configuration with lvds ddr digital outputs selected adc1010s hvqfn40 d5 d4 d3 d2 d1 d0 n.c. n.c. n.c. n.c. vdda inp inm agnd vdda vcm agnd reft refb vdda clkp clkm dec pwd d9 d8 d7 d6 vref sense sdio/ods sclk/dfs otr ognd vddo n.c. dav 10 21 9 22 8 23 7 24 6 25 5 26 4 27 3 28 2 29 1 30 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 agnd terminal 1 index area transparent top view 005aaa135 oe cs adc1010s hvqfn40 d4_d5_m d4_d5_p d2_d3_m d2_d3_p d0_d1_m d0_d1_p n.c. n.c. n.c. n.c. vdda inp inm agnd vdda vcm agnd reft refb vdda clkp clkm dec pwd d8_d9_m d8_d9_p d6_d7_m d6_d7_p vref sense sdio/ods sclk/dfs otr ognd vddo davp davm 10 21 9 22 8 23 7 24 6 25 5 26 4 27 3 28 2 29 1 30 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 agnd terminal 1 index area transparent top view 005aaa136 oe cs table 2. pin description (cmos digital outputs) symbol pin type [1] description refb 1 o bottom reference reft 2 o top reference agnd 3 g analog ground vcm 4 o common-mode output voltage vdda 5 p analog power supply agnd 6 g analog ground inm 7 i complementary analog input inp 8 i analog input agnd 9 g analog ground vdda 10 p analog power supply vdda 11 p analog power supply clkp 12 i clock input clkm 13 i complementary clock input dec 14 o regulator decoupling node oe 15 i output enable, active low pwd 16 i power down, active high
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 4 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs [1] p: power supply; g: ground; i: input; o: output; i/o: input/output. d9 17 o data output bit 9 (most significant bit (msb)) d8 18 o data output bit 8 d7 19 o data output bit 7 d6 20 o data output bit 6 d5 21 o data output bit 5 d4 22 o data output bit 4 d3 23 o data output bit 3 d2 24 o data output bit 2 d1 25 o data output bit 1 d0 26 o data output bit 0 (least significant bit (lsb)) n.c. 27 - not connected n.c. 28 - not connected n.c. 29 - not connected n.c. 30 - not connected dav 31 o data valid output clock n.c. 32 - not connected vddo 33 p output power supply ognd 34 g output ground otr 35 o out of range sclk/dfs 36 i spi clock data format select sdio/ods 37 i/o spi data io output data standard cs 38 i spi chip select sense 39 i reference programming pin vref 40 i/o voltage reference input/output table 3. pin description (lvds ddr) digital outputs) symbol pin [1] type [2] description d8_d9_m 17 o differential output data d8 and d9 multiplexed, complement d8_d9_p 18 o differential output data d8 and d9 multiplexed, true d6_d7_m 19 o differential output data d6 and d7 multiplexed, complement d6_d7_p 20 o differential output data d6 and d7 multiplexed, true d4_d5_m 21 o differential output data d4 and d5 multiplexed, complement d4_d5_p 22 o differential output data d4 and d5 multiplexed, true d2_d3_m 23 o differential output data d2 and d3 multiplexed, complement d2_d3_p 24 o differential output data d2 and d3 multiplexed, true d0_d1_m 25 o differential output data d0 and d1 multiplexed, complement d0_d1_p 26 o differential output data d0 and d1 multiplexed, true n.c. 27 - not connected n.c. 28 - not connected n.c. 29 - not connected table 2. pin description (cmos digital outputs) ?continued symbol pin type [1] description
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 5 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs [1] pins 1 to 16 and pins 33 to 40 are the same for both cmos and lvds ddr outputs (see table 2). [2] p: power supply; g: ground; i: input; o: output; i/o: input/output. 7. limiting values 8. thermal characteristics [1] value for six layers board in still ai r with a minimum of 25 thermal vias. n.c. 30 - not connected davm 31 o data valid output clock, complement davp 32 o data valid output clock, true table 3. pin description (lvds ddr) digital outputs) ?continued symbol pin [1] type [2] description table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v o output voltage pins d9 to d0 or pins d8_d9_p to d0_d1_p and d8_d9_m to d0_d1_m ? 0.4 +3.9 v v dda analog supply voltage ? 0.4 +3.9 v v ddo output supply voltage ? 0.4 +3.9 v t stg storage temperature ? 55 +125 ? c t amb ambient temperature ? 40 +85 ? c t j junction temperature - 125 ? c table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient [1] 22.5 k/w r th(j-c) thermal resistance from junction to case [1] 11.7 k/w
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 6 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 9. static characteristics table 6. static characteristics [1] symbol parameter conditions min typ max unit supplies v dda analog supply voltage 2.85 3.0 3.4 v v ddo output supply voltage cmos mode 1.65 1.8 3.6 v lvds ddr mode 2.85 3.0 3.6 v i dda analog supply current f clk =125msps; f i =70mhz - 210 - ma i ddo output supply current cmos mode; f clk =125msps; f i =70mhz -10-ma lvds ddr mode: f clk =125msps; f i =70mhz -35-ma p power dissipation adc1010s125; analog supply only -630-mw adc1010s105; analog supply only -550-mw adc1010s080; analog supply only -430-mw adc1010s065; analog supply only -380-mw power-down mode - 2 - mw sleep mode - 40 - mw clock inputs: pins clkp and clkm low-voltage positive em itter-coupled logic (lvpecl) v i(clk)dif differential clock input voltage peak-to-peak - 1.6 - v sine wave v i(clk)dif differential clock input voltage peak - ? 3.0 - v low voltage complementary metal oxide semiconductor (lvcmos) v il low-level input voltage - - 0.3v dda v v ih high-level input voltage 0.7v dda --v logic inputs: pins pwd and oe v il low-level input voltage 0 - 0.8 v v ih high-level input voltage 2 - v dda v i il low-level input current - 55 - ? a i ih high-level input current - 65 - ? a serial peripheral interface: pins cs , sdio/ods, sclk/dfs v il low-level input voltage 0 - 0.3v dda v v ih high-level input voltage 0.7v dda -v dda v i il low-level input current ? 10 - +10 ? a i ih high-level input current ? 50 - +50 ? a c i input capacitance - 4 - pf
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 7 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs [1] typical values measured at v dda =3v, v ddo =1.8v, t amb =25 ? c and c l = 5 pf; minimum and maximum values are across the full temperature range t amb = ? 40 ? c to +85 ? c at v dda =3v, v ddo = 1.8 v; v inp ? v inm = ? 1 dbfs; internal reference mode; applied to cmos and lvds interface; unless otherwise specified. digital outputs, cmos mode: pins d9 to d0, otr, dav output levels, v ddo =3v v ol low-level output voltage ognd - 0.2v ddo v v oh high-level output voltage 0.8v ddo -v ddo v c o output capacitance high impedance; oe =high - 3 - pf output levels, v ddo =1.8v v ol low-level output voltage ognd - 0.2v ddo v v oh high-level output voltage 0.8v ddo -v ddo v digital outputs, lvds mode: pins d8_d9_p to d0_d1_p, d8_d9_m to d0_d1_m, davp and davm output levels, v ddo = 3 v only, r l = 100 ? v o(offset) output offset voltage outpu t buffer current set to 3.5 ma -1.2-v v o(dif) differential output voltage output buffer current set to 3.5 ma -350-mv c o output capacitance - 3 - pf analog inputs: pins inp and inm i i input current ? 5- +5 ? a r i(dif) differential input resistance - 19.8 - k ? c i(dif) differential input capacitance - 2.8 - pf v i(cm) common-mode input voltage v inp =v inm 1.1 1.5 2.5 v b i input bandwidth - 650 - mhz v i(dif) differential input voltage peak-to-peak 1 - 2 v common mode output voltage: pin vcm v o(cm) common-mode output voltage - v dda /2 - v i o(cm) common-mode output current - 4 - ma i/o reference voltage: pin vref v vref voltage on pin vref output 0.5 - 1 v input 0.5 - 1 v accuracy inl integral non-linearity - ? 0.07 - lsb dnl differential non-linearity guaranteed no missing codes ? 0.06 ? 0.04 +0.06 lsb e offset offset error - ? 2- mv e g gain error full-scale ? 0.5 % supply psrr power supply rejection ratio 200 mv (p-p) on v dda ; f i =dc - ? 54 - db table 6. static characteristics [1] ?continued symbol parameter conditions min typ max unit
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 8 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 10. dynamic characteristics 10.1 dynamic characteristics table 7. dynamic characteristics [1] symbol parameter conditions adc1010s065 adc1010s080 adc1010s105 adc1010s125 unit min typ max min typ max min typ max min typ max analog signal processing ? 2h second harmonic level f i = 3 mhz - 87 - - 87 - - 89 - - 91 - dbc f i =30mhz -86- -86- -89- -90-dbc f i =70mhz -85- -85- -87- -88-dbc f i = 170 mhz - 82 - - 82 - - 84 - - 86 - dbc ? 3h third harmonic level f i = 3 mhz - 86 - - 86 - - 88 - - 90 - dbc f i =30mhz -85- -85- -88- -89-dbc f i =70mhz -84- -84- -86- -87-dbc f i = 170 mhz - 81 - - 81 - - 83 - - 85 - dbc thd total harmonic distortion f i = 3 mhz - 83 - - 83 - - 85 - - 87 - dbc f i =30mhz -82- -82- -85- -86-dbc f i =70mhz -81- -81- -83- -84-dbc f i = 170 mhz - 78 - - 78 - - 80 - - 82 - dbc enob effective number of bits f i = 3 mhz - 9.9 - - 9.9 - - 9.9 - - 9.9 - bits f i = 30 mhz - 9.9 - - 9.9 - - 9.9 - - 9.9 - bits f i = 70 mhz - 9.9 - - 9.9 - - 9.9 - - 9.9 - bits f i = 170 mhz - 9.9 - - 9.9 - - 9.9 - - 9.9 - bits snr signal-to-noise ratio f i = 3 mhz - 61.7 - - 61.7 - - 61.6 - - 61.6 - dbfs f i = 30 mhz - 61.6 - - 61.6 - - 61.6 - - 61.6 - dbfs f i = 70 mhz - 61.6 - - 61.6 - - 61.5 - - 61.5 - dbfs f i = 170 mhz - 61.5 - - 61.5 - - 61.5 - - 61.5 - dbfs sfdr spurious-free dynamic range f i = 3 mhz - 86 - - 86 - - 88 - - 90 - dbc f i =30mhz -85- -85- -88- -89-dbc f i =70mhz -84- -84- -86- -87-dbc f i = 170 mhz - 81 - - 81 - - 83 - - 85 - dbc
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 9 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs [1] typical values measured at v dda =3v, v ddo =1.8v, t amb =25 ? c and c l = 5 pf; minimum and maximum values are across the full temperature range t amb = ? 40 ? c to +85 ? c at v dda =3v, v ddo = 1.8 v; v inp ? v inm = ? 1 dbfs; internal reference mode; applied to cmos and lvds interface; unless otherwise specified. 10.2 clock and digital output timing imd intermodulation distortion f i = 3 mhz - 89 - - 89 - - 92 - - 93 - dbc f i =30mhz -88- -88- -92- -92-dbc f i =70mhz -87- -87- -90- -90-dbc f i = 170 mhz - 84 - - 85 - - 87 - - 88 - dbc table 7. dynamic characteristics [1] ?continued symbol parameter conditions adc1010s065 adc1010s080 adc1010s105 adc1010s125 unit min typ max min typ max min typ max min typ max table 8. clock input and digital output timing characteristics [1] symbol parameter conditions adc1010s065 adc1010s080 adc1010s105 adc1010s125 unit min typ max min typ max min typ max min typ max clock timing input: pins clkp and clkm f clk clock frequency 40 - 65 60 - 80 75 - 105 100 - 125 mhz t lat(data) data latency time - 13.5 - - 13.5 - - 13.5 - - 13.5 - clock cycles ? clk clock duty cycle dcs_en = logic 1 30 50 70 30 50 70 30 50 70 30 50 70 % dcs_en = logic 0 45 50 55 45 50 55 45 50 55 45 50 55 % t d(s) sampling delay time -0.8- -0.8- -0.8- -0.8-ns t wake wake-up time -76- -76- -76- -76- ? s cmos mode timing output: pins d9 to d0 and dav t pd propagation delay data 13.6 14.9 16.4 11.9 12.9 14.4 8.0 10.8 12.4 8.2 9.7 11.3 ns dav - 4.2 - - 3.6 - - 3.3 - - 3.4 - ns t su set-up time - 12.5 - - 9.8 - - 6.8 - - 5.6 - ns t h hold time - 3.4 - - 3.3 - - 3.1 - - 2.8 - ns t r rise time data [2] 0.39 - 2.4 0.39 - 2.4 0.39 - 2.4 0.39 - 2.4 ns dav 0.26- 2.40.26- 2.40.26- 2.40.26-2.4ns t f fall time data [2] 0.19 - 2.4 0.19 - 2.4 0.19 - 2.4 0.19 - 2.4 ns
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 10 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs [1] typical values measured at v dda =3v, v ddo =1.8v, t amb =25 ? c and c l = 5 pf; minimum and maximum values are across the full temperature range t amb = ? 40 ? c to +85 ? c at v dda =3v, v ddo = 1.8 v; v inp ? v inm = ? 1 dbfs; internal reference mode; applied to cmos and lvds interface; unless otherwise specified. [2] measured between 20 % to 80 % of v ddo . [3] rise time measured from ? 50 mv to +50 mv; fall time measured from +50 mv to ? 50 mv. lvds ddr mode timing output: pins d8_d9_p to d0_d1_p, d8_d9_m to d0_d1_m, davp and davm t pd propagation delay data 3.3 5.1 7.6 2.9 4.6 7.1 2.5 4.2 6.8 2.2 4.0 6.6 ns dav - 2.8 - - 2.5 - - 2.3 - - 2.2 - ns t su set-up time - 5.4 - - 4.1 - - 2.6 - - 1.9 - ns t h hold time - 2.2 - - 2.0 - - 1.8 - - 1.7 - ns t r rise time data [3] 0.5 - 5 0.5 - 5 0.5 - 5 0.5 - 5 ns dav 0.18- 2.40.18- 2.40.18- 2.40.18-2.4ns t f fall time data [3] 0.15 - 1.6 0.15 - 1.6 0.15 - 1.6 0.15 - 1.6 ns table 8. clock input and digital output timing characteristics [1] ?continued symbol parameter conditions adc1010s065 adc1010s080 adc1010s105 adc1010s125 unit min typ max min typ max min typ max min typ max
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 11 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs fig 4. cmos mode and clock timing fig 5. ldvs ddr mode and clock timing (n ? 12) t d(s) t clk n n + 1 n + 2 t clk t su t pd t h t pd clkp clkm data dav 005aaa060 (n ? 11) (n ? 13) (n ? 14) 005aaa061 (n ? 14) t d(s) t clk n n + 1 n + 2 clkp clkm davp davm t su t h t h t su t pd t pd d x _d x + 1 _p d x _d x + 1 _m d x d x + 1 d x + 1 d x + 1 d x + 1 d x + 1 d x d x d x d x (n ? 11) (n ? 12) (n ? 13) t clk
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 12 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 10.3 spi timings [1] typical values measured at v dda =3v, v ddo =1.8v, t amb =25 ? c and c l = 5 pf; minimum and maximum values are across the full temperature range t amb = ? 40 ? c to +85 ? c at v dda =3v, v ddo =1.8v table 9. spi timings characterist ics [1] symbol parameter conditions min typ max unit t w(sclk) sclk pulse width - 40 - ns t w(sclkh) sclk high pulse width - 16 - ns t w(sclkl) sclk low pulse width - 16 - ns t su set-up time data to sclk high - 5 - ns cs to sclk high - 5 - ns t h hold time data to sclk high - 2 - ns cs to sclk high - 2 - ns f clk(max) maximum clock frequency - 25 - mhz fig 6. spi timing t su sdio sclk r/w w1 w0 a12 a11 d2 d1 d0 t su t h t h t w(sclk) 005aaa065 cs t w(sclkl) t w(sclkh)
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 13 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 10.4 typical characteristics fig 7. capacitance as a function of frequency fig 8. resistance as a function of frequency f (mhz) 50 550 450 250 350 150 001aam619 2.8 2.6 3.0 3.2 c (pf) 2.4 f (mhz) 50 550 450 250 350 150 001aam614 8 4 12 16 r (k ) 0 t=25 ? c; v dd =3v; f i = 170 mhz; f s = 125 msps (1) dcs on (2) dcs off t=25 ? c; v dd =3v; f i = 170 mhz; f s = 125 msps (1) dcs on (2) dcs off fig 9. sfdr as a function of duty cycle ( ? ) fig 10. snr as a function of duty cycle ( ? ) (%) 10 90 70 30 50 001aam616 40 60 20 80 100 sfdr (dbc) 0 (1) (2) (%) 10 90 70 30 50 001aam615 40 20 60 80 snr (dbfs) 0 (1) (2)
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 14 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs (1) t amb = ? 40 ? c/typical supply voltages (2) t amb =+25 ? c/typical supply voltages (3) t amb =+90 ? c/typical supply voltages (1) t amb = ? 40 ? c/typical supply voltages (2) t amb =+25 ? c/typical supply voltages (3) t amb =+90 ? c/typical supply voltages fig 11. sfdr as a function of duty cycle ( ? ) fig 12. snr as a function of duty cycle ( ? ) (%) 10 90 70 30 50 001aam617 84 88 92 sfdr (dbc) 80 (1) (2) (3) (%) 10 90 70 30 50 001aam618 40 60 80 snr (dbfs) 20 (1) (2) (3) fig 13. sfdr as a function of common-mode input voltage (v i(cm) ) fig 14. snr as a function of common-mode input voltage (v i(cm) ) v i(cm) (v) 3.5 2.5 0.5 3.0 2.0 1.0 0 1.5 001aam659 78 74 86 82 90 sfdr (dbc) 70 v i(cm) (v) 3.5 2.5 0.5 3.0 2.0 1.0 0 1.5 001aam660 69 67 73 71 75 snr (dbfs) 65
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 15 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11. application information 11.1 device control the adc1010s can be controlled via spi or dire ctly via the i/o pins (pin control mode). 11.1.1 spi and pin control modes the device enters pin control mode at power-up, and remains in this mode as long as pin cs is held high. in pin control mode, the spi pins sdio, cs and sclk are used as static control pins. spi control mode is enabled by forcing pin cs low. once spi control mode has been enabled, the device remains in this mode. th e transition from pin control mode to spi control mode is illustrated in figure 15. when the device enters spi control mode, the output data standard and data format are determined by the level on pin sdio at the instant a transi tion is triggered by a falling edge on cs . 11.1.2 operating mode selection the active adc1010s operating mode (power-u p, power-down or sleep) can be selected via the spi interface (see table 20) or by using pins pwd and oe in pin control mode, as described in table 10. 11.1.3 selecting the output data standard the output data standard (cmos or lvds ddr) can be selected via the spi interface (see table 23) or by using pin ods in pin control mode. lvds ddr is selected when ods is high, otherwise cmos is selected. fig 15. control mode selection r/w spi control mode pin control mode data format offset binary data format two's complement lvds ddr sdio/ods sclk/dfs w1 w0 a12 005aaa039 cmos cs table 10. operating mode selection via pin pwd and oe pin pwd pin oe operating mode output high-z low low power-up no low high power-up yes high low sleep yes high high power-down yes
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 16 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.1.4 selecting the output data format the output data format can be selected via the spi interface (offset binary, two?s complement or gray code; see table 23) or by using pin dfs in pin control mode (offset binary or two?s complement). offset binary is selected when dfs is low. when dfs is high, two?s complement is selected. 11.2 analog inputs 11.2.1 input stage the analog input of the adc1010s supports a di fferential or a single-ended input drive. optimal performance is achieved using diff erential inputs with the common-mode input voltage (v i(cm) ) on pins inp and inm set to 0.5v dda . the full-scale analog input voltage range is configurable between 1 v (p-p) and 2 v (p-p) via a programmable internal reference (see section 11.3 and table 22). the equivalent circuit of the sample and hold input stage, including electrostatic discharge (esd) protection and circuit and package parasitics, is shown in figure 16. the sample phase occurs when the internal clock (derived from the clock signal on pin clkp/clkm) is high. the voltage is then he ld on the sampling capacitors. when the clock signal goes low, the stage enters the hold phase and the voltage information is transmitted to the adc core. 11.2.2 anti-kickback circuitry anti-kickback circuitry (r-c filter in figure 17) is needed to counteract the effects of a charge injection generated by the sampling capacitance. the rc filter is also used to filter noise from the signal before it reaches the sampling stage. the value of the capacitor should be ch osen to maximize noise attenuation without degrading the settling time excessively. fig 16. input sampling circuit 005aaa043 inp package esd parasitics switch r on = 15 4 pf 4 pf sampling capacitor sampling capacitor switch r on = 15 inm 8 7 internal clock internal clock
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 17 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs the component values are determined by the input frequency and should be selected so as not to affect the input bandwidth. 11.2.3 transformer the configuration of the transf ormer circuit is determined by the input frequency. the configuration shown in figure 18 would be suitable for a baseband application. the configuration shown in figure 19 is recomme nded for high frequency applications. in both cases, the choice of transformer is a compromise between cost and performance. fig 17. anti-kickback circuit table 11. rc coupling versus input frequency - typical values input frequency r c 3 mhz 25 ? 12 pf 70 mhz 12 ? 8 pf 170 mhz 12 ? 8 pf 005aaa073 r r c inp inm fig 18. single transformer configuratio n suitable for baseband applications 005aaa044 100 nf 100 nf 100 nf 100 nf 25 25 25 25 12 pf inp inm vcm 100 nf analog input adt1-1wt 100 nf
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 18 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.3 system reference and power management 11.3.1 internal/external references the adc1010s has a stable and accurate built-i n internal reference vo ltage to adjust the adc full-scale. this reference voltage can be se t internally via spi or with pins vref and sense (programmable in 1 db steps between 0 db and ? 6 db via control bits intref[2:0] when bit intref_en = logic 1; see table 22). see figure 21 to figure 24. the equivalent reference circuit is shown in figure 20. an external reference is also possible by providing a voltage on pin vref as described in figure 23. fig 19. dual transformer configuration suitable for a high intermediate frequency application 005aaa045 100 nf 100 nf 100 nf 100 nf 12 12 8.2 pf inp inm vcm 50 50 50 50 adt1-1wt adt1-1wt analog input
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 19 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs if bit intref_en is set to logic 0, the reference voltage is determined either internally or externally as detailed in table 12. [1] the voltage on pin vref is doubled internally to generate the internal reference voltage. figure 21 to figure 24 illustrate how to connect the sense and vref pins to select the required reference voltage source. fig 20. reference equivalent schematic table 12. reference selection selection spi bit intref_en sense pin vref pin full-scale (p-p) internal (figure 21) 0 agnd 330 pf capacitor to agnd 2 v internal (figure 22) 0 pin vref connected to pin sense and via a 330 pf capacitor to agnd 1 v external (figure 23) 0v dda external voltage between 0.5 v and 1 v [1] 1 v to 2 v internal via spi (figure 24) 1 pin vref connected to pin sense and via 330 pf capacitor to agnd 1 v to 2 v ext_ref ext_ref 005aaa164 reft refb sense vref selection logic bandgap reference adc core buffer reference amp
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 20 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.3.2 programmable full-scale the full-scale is programmable between 1 v (peak-to-peak) to 2 v (pea k-to-peak) (see table 13). fig 21. internal reference, 2 v (p-p) full-scale fig 22. internal reference, 1 v (p-p) full-scale fig 23. external reference, 1 v (p-p) to 2 v (p-p) full-scale fig 24. internal reference vi a spi, 1 v (p-p) to 2 v (p-p) full-scale 330 pf vref sense 005aaa116 reference equivalent schematic 330 pf 005aaa117 vref sense reference equivalent schematic 0.1 f vdda v 005aaa119 vref sense reference equivalent schematic reference equivalent schematic 330 pf 005aaa118 vref sense table 13. reference spi gain control intref[2:0] gain (db) full-scale (v (p-p)) 000 0 2 001 ? 11.78 010 ? 21.59 011 ? 31.42 100 ? 41.26 101 ? 51.12 110 ? 61 111 reserved x
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 21 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.3.3 common-mode output voltage (v o(cm) ) a 0.1 ? f filter capacitor should be connected between pin vcm and ground to ensure a low-noise common-mode output voltage. when ac-coupled, pin vcm can then be used to set the common-mode reference for the analog inputs, for instance via a transformer middle point. 11.3.4 biasing the common-mode input voltage (v i(cm) ) on pins inp and inm should be set externally to 0.5v dda for optimal performance and should always be between 0.9 v and 2 v. 11.4 clock input 11.4.1 drive modes the adc1010s can be driven di fferentially (lvpecl). it c an also be driven by a single-ended low voltage complementary metal oxide semiconductor (lvcmos) signal connected to pin clkp (pin clkm should be connected to ground via a capacitor) or pin clkm (pin clkp should be connected to ground via a capacitor). fig 25. equivalent schematic of the common-mode reference circuit 1.5 v vcm 0.1 f package esd parasitics 005aaa051 common-mode reference adc core a. rising edge lvcmos b. falling edge lvcmos fig 26. lvcmos single-ended clock input lvcmos clock input clkp clkm 005aaa174 005aaa053 lvcmos clock input clkp clkm
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 22 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.4.2 equivalent input circuit the equivalent circuit of the input clock buffer is shown in figure 28. the common-mode voltage of the differential input stage is set via internal 5 k ? resistors. a. sine clock input b. sine clock input (with transformer) c. lvpecl clock input fig 27. differential clock input sine clock input clkp clkm 005aaa173 sine clock input clkp clkm 005aaa054 lvpecl clock input 005aaa172 clkp clkm v cm(clk) = common-mode voltage of the differential input stage. fig 28. equivalent input circuit clkp clkm 005aaa056 package esd parasitics 5 k 5 k v cm(clk) se_sel se_sel
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 23 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs single-ended or differential clock inputs c an be selected via the spi interface (see table 21). if single-ended is enabled, the input pin (clkm or clkp) is selected via control bit se_sel. if single-ended is implemented without settin g bit se_sel to the appropriate value, the unused pin should be connected to ground via a capacitor. 11.4.3 duty cycle stabilizer the duty cycle stabilizer can improve th e overall performance of the adc by compensating the duty cycle of the input clock signal. when the duty cycle stabilizer is active (bit dcs_en = logic 1; see table 21), the circuit can handle signals with duty cycles of between 30 % and 70 % (typical). when the duty cycle stabilizer is disabled (dcs_en = logic 0), the input clock signal s hould have a duty cycle of between 45 % and 55 %. 11.4.4 clock input divider the adc1010s contains an input clock divider that divides the incoming clock by a factor of 2 (when bit clkdiv = logic 1; see table 21). this feature allows the user to deliver a higher clock frequency with better jitter performance, leading to a better snr result once acquisition has been performed. 11.5 digital outputs 11.5.1 digital output buffers: cmos mode the digital output buffers can be configured as cmos by setting bit lvds_cmos to logic 0 (see table 23). each digital output has a dedicated output buffer. the equivalent circuit of the cmos digital output buffer is shown in figure 29. the buffer is powered by a separate power supply, pins ognd and vddo, to ensure 1.8 v to 3.3 v compatibility and is isolated from the adc core. each buffer can be loaded by a maximum of 10 pf. fig 29. cmos digital output buffer vddo esd package parasitics ognd dx 005aaa057 50 logic driver
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 24 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs the output resistance is 50 ? and is the combination of an internal resistor and the equivalent output resistance of the buffer. there is no need for an external damping resistor. the drive strength of both data and dav buffers can be programmed via the spi in order to adjust the rise and fall times of the output digital signals (see table 30): 11.5.2 digital output buffers: lvds ddr mode the digital output buffers can be configured as lvds ddr by setting bit lvds_cmos to logic 1 (see table 23). each output should be terminated externally with a 100 ? resistor (typical) at the receiver side (figure 30) or internally via spi control bits lvds_int_ter[2:0] (see figure 31 and table 32). the default lvds ddr output buf fer current is set to 3.5 ma. it can be programmed via the spi (bits davi[1:0] and data[1:0]; see table 31) in order to adjust the output logic voltage levels. fig 30. lvds ddr digital output buffer - externally terminated fig 31. lvds ddr digital output buffer - internally terminated vddo 3.5 ma typ d x p/d x + 1 p d x m/d x + 1 m ognd 100 ? 005aaa058 + ? + receiver vddo ognd 005aaa059 d x p/d x + 1 p d x m/d x + 1 m 100 3.5 ma typ + ? + ? receiver
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 25 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.5.3 data valid (dav) output clock a data valid output clock signal (dav) can be used to capture the data delivered by the adc1010s. detailed timing diagrams for cmos and lvds ddr modes are shown in figure 4 and figure 5 respectively. 11.5.4 out-of-range (otr) an out-of-range signal is provided on pin otr. the latency of otr is fourteen clock cycles. the otr response can be speeded up by enabling fast otr (bit fastotr = logic 1; see table 29). in this mode , the latency of otr is reduced to only four clock cycles. the fast otr detection threshold (below full-scale) can be programmed via bits fastotr_det[2:0]. 11.5.5 digital offset by default, the adc1010s delivers output code that corresponds to the analog input. however it is possible to add a digital offset to the output code via the spi (bits dig_offset[5:0]; see table 25). 11.5.6 test patterns for test purposes, the adc1010s can be configured to transmit one of a number of predefined test patterns (via bits testpat_ sel[2:0]; see table 26). a custom test pattern can be defined by the user (testpat_user [9:0]; see table 27 and table 28) and is selected when testpat_sel[2:0] = 101. the selected test patte rn is transmitted regardless of the analog input. table 14. lvds ddr output register 2 lvds_int_ter[2:0] resistor value ( ? ) 000 no internal termination 001 300 010 180 011 110 100 150 101 100 110 81 111 60 table 15. fast otr register fastotr_det[2:0] detection level (db) 000 ? 20.56 001 ? 16.12 010 ? 11.02 011 ? 7.82 100 ? 5.49 101 ? 3.66 110 ? 2.14 111 ? 0.86
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 26 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.5.7 output codes versus input voltage 11.6 serial peripheral interface 11.6.1 register description the adc1010s serial interface is a synchronous serial communications port that allows easy interfacing with many commonly-used microprocessors. it provides access to the registers that control the operation of the chip. this interface is configured as a 3- wire type (sdio as bidirectional pin) pin sclk is the serial clock input and cs is the chip select pin. each read/write operation is initiated by a low level on pin cs . a minimum of three bytes is transmitted (two instructio n bytes and at least one data byte). the number of data bytes is determined by the value of bits w1 and w2 (see table 18). [1] bit r/w indicates whether it is a read (logic 1) or a write (logic 0) operation. [2] bits w1 and w0 indicate the number of bytes to be transferred after the instruction byte (see table 18). table 16. output codes v inp ? v inm offset binary two?s complement otr pin < ? 1 00 0000 0000 10 0000 0000 1 ? 1.0000000 00 0000 0000 10 0000 0000 0 ? 0.9980469 00 0000 0001 10 0000 0001 0 ? 0.9960938 00 0000 0010 10 0000 0010 0 ? 0.9941406 00 0000 0011 10 0000 0011 0 ? 0.9921875 00 0000 0100 10 0000 0100 0 .... .... .... 0 ? 0.0039063 01 1111 1110 11 1111 1110 0 ? 0.0019531 01 111 1111 11 1111 1111 0 0.0000000 10 0000 0000 00 0000 0000 0 +0.0019531 10 0000 0001 00 0000 0001 0 +0.0039063 10 0000 0010 00 0000 0010 0 .... .... .... 0 +0.9921875 11 1111 1011 01 1111 1011 0 +0.9941406 11 1111 1100 01 1111 1100 0 +0.9960938 11 1111 1101 01 1111 1101 0 +0.9980469 11 1111 1110 01 1111 1110 0 +1.0000000 11 1111 1111 01 1111 1111 0 > +1 11 1111 1111 01 1111 1111 1 table 17. instruction bytes for the spi msb lsb bit 76543210 description r/w [1] w1 [2] w0 [2] a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 27 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs bits a12 to a0 indicate the address of the register being accessed. in the case of a multiple byte transfer, this address is the first register to be accessed. an address counter is increased to access subsequent addresses. the steps involved in a data transfer are as follows: 1. a falling edge on cs in combination with a rising edge on sclk determine the start of communications. 2. the first phase is the transfer of the 2-byte instruction. 3. the second phase is the transfer of the data which can vary in length but is always a multiple of 8 bits. the msb is always sent first (for instruction and data bytes). 4. a rising edge on cs indicates the end of data transmission. 11.6.2 default modes at start-up during circuit initialization, it does no t matter which output data standard has been selected. at power-up, the dev ice enters pin control mode. a falling edge on cs triggers a transition to spi control mode. when the adc1010s enters spi control mo de, the output data standard (cmo s/lvds ddr) is determined by the level on pin sdio (see figure 33). once in spi control mode, the output data standard can be changed via bit lvds_cmos in ta b l e 2 3 . when the adc1010s enters spi control mode, th e output data format (two?s complement or offset binary) is determined by the level on pin sclk (gray code can only be selected via the spi). once in spi control mode, the output data format can be changed via bit data_format[1:0] in table 23. table 18. number of data bytes to be transferred after the instruction bytes w1 w0 number of bytes transmitted 001 byte 012 bytes 103 bytes 1 1 4 bytes or more fig 32. spi mode timing sclk sdio r/w w1 w0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 d7 d6 d5 d4 d3 d2 d1 d3 d2 d1 d0 d0 d7 d6 d5 d4 instruction bytes register n (data) register n + 1 (data) 005aaa062 cs
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 28 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs fig 33. default mode at start-up: sclk low = offset binary; sdio high = lvds ddr fig 34. default mode at start-up: sclk high = two?s complement; sdio low = cmos cs sdio (cmos lvds ddr) sclk (data format) offset binary, lvds ddr default mode at start-up 005aaa063 sdio (cmos lvds ddr) sclk (data format) two's complement, cmos default mode at start-up 005aaa064 cs
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 29 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 11.6.3 register allocation map table 19. register allocation map addr hex register name r/w bit definition default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bin 0005 reset and operating mode r/w sw_rst reserved[2:0] - - op_mode[1:0] 0000 0000 0006 clock r/w - - - se_sel diff_se - clkdiv dcs_en 0000 0001 0008 internal reference r/w - - - - intref_en intref[2:0] 0000 0000 0011 output data standard r/w - - - lvds_ cmos outbuf outbus_ swap data_format[1:0] 0000 0000 0012 output clock r/w - - - - davinv davphase[2:0] 0000 1110 0013 offset r/w - - dig_offset[5:0] 0000 0000 0014 test pattern 1 r/w - - - - - testpat_sel[2:0] 0000 0000 0015 test pattern 2 r/w testpat_user[9:2] 0000 0000 0016 test pattern 3 r/w testpat_ user[1:0] - - - - 0000 0000 0017 fast otr r/w - - - - fastotr fastotr_det[2:0] 0000 0000 0020 cmos output r/w - - - - dav_drv[1:0] data_drv[1:0] 0000 1110 0021 lvds ddr o/p 1 r/w - - davi_x2_en davi[1:0] datai_ x2_en datai[1:0] 0000 0000 0022 lvds ddr o/p 2 r/w - - - - bit_ byte_wise lvds_int _ter[2:0] 0000 0000
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 30 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs table 20. reset and operating mode control register (address 0005h) bit description default values are highlighted. bit symbol access value description 7 sw_rst r/w reset digital section 0no reset 1 performs a reset of the spi registers 6 to 4 reserved[2:0] 000 reserved 3 to 2 - 00 not used 1 to 0 op_mode[1:0] r/w operating mode 00 normal (power-up) 01 power-down 10 sleep 11 normal (power-up) table 21. clock control register (address 0006h) bit description default values are highlighted. bit symbol access value description 7 to 5 - 000 not used 4 se_sel r/w single-ended clock input pin select 0clkm 1clkp 3 diff_se r/w differential/single ended clock input select 0 fully differential 1 single-ended 2 - 0 not used 1 clkdiv r/w clock input divide by 2 0disabled 1 enabled 0 dcs_en r/w duty cycle stabilizer 0 disabled 1 enabled
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 31 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs table 22. internal reference control register (address 0008h) bit description default values are highlighted. bit symbol access value description 7 to 4 - 0000 not used 3 intref_en r/w programmable internal reference enable 0disable 1 active 2 to 0 intref[2:0] r/w programmable internal reference 000 fs = 2 v 001 fs = 1.78 v 010 fs = 1.59 v 011 fs = 1.42 v 100 fs = 1.26 v 101 fs = 1.12 v 110 fs = 1 v 111 reserved table 23. output data standard control register (address 0011h) bit description default values are highlighted. bit symbol access value description 7 to 5 - 000 not used 4 lvds_cmos r/w output data standard: lvds ddr or cmos 0cmos 1 lvds ddr 3 outbuf r/w output buffers enable 0output enabled 1 output disabled (high-z) 2 outbus_swap r/w output bus swapping 0 no swapping 1 output bus is swapping (msb becomes lsb and vice versa) 1 to 0 data_format[1:0] r/w output data format 00 offset binary 01 two?s complement 10 gray code 11 offset binary
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 32 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs table 24. output clock register (address 0012h) bit description default values are highlighted. bit symbol access value description 7 to 4 - 0000 not used 3 davinv r/w output clock data valid (dav) polarity 0normal 1inverted 2 to 0 davphase[2:0] r/w dav phase select 000 output clock shifted (ahead) by 6/16 ? t clk 001 output clock shifted (ahead) by 5/16 ? t clk 010 output clock shifted (ahead) by 4/16 ? t clk 011 output clock shifted (ahead) by 3/16 ? t clk 100 output clock shifted (ahead) by 2/16 ? t clk 101 output clock shifted (ahead) by 1/16 ? t clk 110 default value as defined in timing section 111 output clock shifted (delayed) by 1/16 ? t clk table 25. offset register (add ress 0013h) bit description default values are highlighted. bit symbol access value description 7 to 6 - 00 not used 5 to 0 dig_offset[5:0] r/w digital offset adjustment 011111 +31 lsb ... ... 000000 0 ... ... 100000 ? 32 lsb table 26. test pattern register 1 (address 0014h) bit description default values are highlighted. bit symbol access value description 7 to 3 - 00000 not used 2 to 0 testpat_sel[2:0] r/w di gital test pattern select 000 off 001 mid scale 010 ? fs 011 +fs 100 toggle ?1111..1111?/?0000..0000? 101 custom test pattern 110 ?1010..1010.? 111 ?010..1010?
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 33 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs table 27. test pattern register 2 (address 0015h) bit description default values are highlighted. bit symbol access value description 7 to 0 testpat_user[9:2] r/w 00000000 custom digital test pattern (bits 9 to 2) table 28. test pattern register 3 (address 0016h) bit description default values are highlighted. bit symbol access value description 7 to 6 testpat_user[1:0] r/w 00 custom digital test pattern (bits 1 to 0) 5 to 0 - 000000 not used table 29. fast otr register (address 0017h) bit description default values are highlighted. bit symbol access value description 7 to 4 - 0000 not used 3 fastotr r/w fast out-of-range (otr) detection 0 disabled 1 enabled 2 to 0 fastotr_det[2:0] r/w set fast otr detect level 000 ? 20.56 db 001 ? 16.12 db 010 ? 11.02 db 011 ? 7.82 db 100 ? 5.49 db 101 ? 3.66 db 110 ? 2.14 db 111 ? 0.86 db table 30. cmos output register (address 0020h) bit description default values are highlighted. bit symbol access value description 7 to 4 - 0000 not used 3 to 2 dav_drv[1:0] r/w drive strength for dav cmos output buffer 00 low 01 medium 10 high 11 very high 1 to 0 data_drv[1:0] r/w drive str ength for data cmos output buffer 00 low 01 medium 10 high 11 very high
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 34 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs table 31. lvds ddr output register 1 (address 0021h) bit description default values are highlighted. bit symbol access value description 7 to 6 - 00 not used 5 davi_x2_en r/w double lvds current for dav lvds buffer 0 disabled 1 enabled 4 to 3 davi[1:0] r/w lvds current for dav lvds buffer 00 3.5 ma 01 4.5 ma 10 1.25 ma 11 2.5 ma 2 datai_x2_en r/w double lvds current for data lvds buffer 0 disabled 1 enabled 1 to 0 datai[1:0] r/w lvds current for data lvds buffer 00 3.5 ma 01 4.5 ma 10 1.25 ma 11 2.5 ma table 32. lvds ddr output register 2 (address 0022h) bit description default values are highlighted. bit symbol access value description 7 to 4 - 0000 not used 3 bit_byte_wise r/w ddr mode for lvds output 0 bit wise (even data bits output on dav rising edge/odd data bits output on dav falling edge) 1 byte wise (msb data bits output on dav rising edge/lsb data bits output on dav falling edge) 2 to 0 lvds_int_ter[2:0] r/w internal termination for lvds buffer (dav and data) 000 no internal termination 001 300 ? 010 180 ? 011 110 ? 100 150 ? 101 100 ? 110 81 ? 111 60 ?
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 35 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 12. package outline fig 35. package outline sot618-1 (hvqfn40) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 6.1 5.9 d h 4.25 3.95 y 1 6.1 5.9 4.25 3.95 e 1 4.5 e 2 4.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot618-1 mo-220 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot618-1 hvqfn40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 11 20 40 31 30 21 10 1 x d e c b a e 2 01-08-08 02-10-22 terminal 1 index area 1/2 e 1/2 e a c c b v m w m note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) e (1)
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 36 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 13. revision history 14. contact information for more information or sales office addresses, please visit: http://www.idt.com table 33. revision history document id release date data sheet status change notice supersedes adc1010s_ser v.3 20120702 product data sheet - adc1010s_ser_2 adc1010s_ser v.2 20101228 product data sheet - adc1010s_ser_1 modifications: ? data sheet status changed from preliminary to product. ? text and drawings updated throughout entire data sheet. ? sot618-6 changed to sot618-1. see table 1 ?ordering information? and figure 35 ?package outline sot618-1 (hvqfn40)?. ? section 10.4 ?typical characteristics? added to the data sheet. adc1010s_ser_1 20100409 preliminary data sheet - -
adc1010s_ser 3 ? idt 2012. all rights reserved. product data sheet rev. 03 ? 2 july 2012 37 of 37 integrated device technology adc1010s series single 10-bit adc; cmos or lvds ddr digital outputs 15. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 thermal characteristics . . . . . . . . . . . . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 10.1 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 10.2 clock and digital output timing . . . . . . . . . . . . . 9 10.3 spi timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10.4 typical characteristics . . . . . . . . . . . . . . . . . . 13 11 application information. . . . . . . . . . . . . . . . . . 15 11.1 device control . . . . . . . . . . . . . . . . . . . . . . . . . 15 11.1.1 spi and pin control modes . . . . . . . . . . . . . . . 15 11.1.2 operating mode selection. . . . . . . . . . . . . . . . 15 11.1.3 selecting the output data standard . . . . . . . . . 15 11.1.4 selecting the output data format. . . . . . . . . . . 16 11.2 analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . 16 11.2.1 input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 11.2.2 anti-kickback circuitry . . . . . . . . . . . . . . . . . . . 16 11.2.3 transformer . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11.3 system reference and power management . . 18 11.3.1 internal/external references . . . . . . . . . . . . . . 18 11.3.2 programmable full-scale . . . . . . . . . . . . . . . . 20 11.3.3 common-mode output voltage (v o(cm) ) . . . . . 21 11.3.4 biasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.4 clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.4.1 drive modes . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.4.2 equivalent input circuit . . . . . . . . . . . . . . . . . . 22 11.4.3 duty cycle stabilizer . . . . . . . . . . . . . . . . . . . . 23 11.4.4 clock input divider . . . . . . . . . . . . . . . . . . . . . 23 11.5 digital outputs . . . . . . . . . . . . . . . . . . . . . . . . 23 11.5.1 digital output buffers: cmos mode . . . . . . . . 23 11.5.2 digital output buffers: lvds ddr mode . . . . 24 11.5.3 data valid (dav) output clock . . . . . . . . . . . . 25 11.5.4 out-of-range (otr) . . . . . . . . . . . . . . . . . . . 25 11.5.5 digital offset . . . . . . . . . . . . . . . . . . . . . . . . . . 25 11.5.6 test patterns . . . . . . . . . . . . . . . . . . . . . . . . . 25 11.5.7 output codes versus input voltage. . . . . . . . . 26 11.6 serial peripheral interface . . . . . . . . . . . . . . . 26 11.6.1 register description . . . . . . . . . . . . . . . . . . . . 26 11.6.2 default modes at start-up. . . . . . . . . . . . . . . . 27 11.6.3 register allocation map . . . . . . . . . . . . . . . . . 29 12 package outline. . . . . . . . . . . . . . . . . . . . . . . . 35 13 revision history . . . . . . . . . . . . . . . . . . . . . . . 36 14 contact information . . . . . . . . . . . . . . . . . . . . 36 15 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

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